Capabilities

COB

Chip On Board
Chip On Board Chip On Board
Chip On Board
COB Bonding
  • Fine pitched ball screw providing XY table
  • Auto-Calibration ultrasonic generator
  • Bond quality monitoring system
  • Dual monitor display
  • Digital bond head and rotary work chuck
  • Cycle time: 250ms for 2.0mm long wire (1 die)
  • Bond angle: 30o
  • Wire size: 25.4~50.8µm dia.
  • Bond force: 15~150g
  • Bond power: ~1W
  • Bond placement: ±20.4µ(3σ)