Surface Mount Technology

Due to the popularity of small portable devices, such as smart phones, digital cameras, and MP3
players, there is a strong demand for high speed and high density Surface Mount Technology (SMT).

Santek has fully installed the most up-to-date SMT Line with 0201 chip size capabilities to satisfy
these needs. Santek is committed to taking an active role in protecting the environment.

Complying with European directive RoHS is just one of our long term commitments to meeting
both international standards and customer requirements.

Screen Printer

  • Full Vision Automatic Screen Printer
  • Standard floating printing heat unit
  • Standard front / back stainless squeegee (330mm)
  • Conveyor speed: ~1500mm/s
  • Squeegee speed: ~300mm/s
  • Cycle time: <10s (w/o printing/cleaning time)
  • Stencil Size: 50x50~400x350mm
  • PCB thickness:0.6~4mm
  • PCB warpage: <1%
  • Position repeatability: ±0.01mm
  • Accuracy: ±0.025mm

Buffer Inspection

  • PCB width: 30~300mm

Component Placer

  • Advanced Flexible Mounter
  • On-The-Fly recognition technology
  • Polygon recognition function
  • Placement speed: (Under the optimal condition)
  • Chip: 0.172s/chip
    SOP: 0.24s/chip
    QFP: 0.6s/chip
  • PCB size: 50x40 ~ 460x400mm
  • PCB thickness: 0.38~4.2mm
  • Placement Accuracy: Chip: ±50µm, QFP: ±30µm
  • Chip Size: 0201~□55mm IC(MFOV)

Component Placer

  • Lead-free Hot Air Reflow Soldering System
  • Zone configuration: 8 hot air heating zones 16 heating modules 1 cooling zone
  • Conveyor speed: 0.35~1.5m/min
  • Temperature: RT~300oC

Component Placer

  • Lead free Wave Soldering System
  • Dual Wave Solder Pot Air cooling system
  • 3 preheat zones(1 Infrared heater)
  • Conveyor speed: 0.5~1.5m/min
  • PCB width: 50~300mm
  • Soldering temp: ~350mm
  • Soldering angle: 4~6o