製造能力

COG & ACF

COG 実装技術 ＆ 異方性導電膜（ACF)
Chip on Glass & Anisotropic Conductive Film

COGチップオングラス実装技術

COG - Chip on Glass COG - Chip on Glass
COG - Chip on Glass
COG 実装
  • [Pre-bonder]A-30E CM
  • Tact time: 5.2s / 1chip
  • Chip size: 3x0.6~3x5mm
  • Chip thickness:0.3~1.0mm

  • [Main-bonder]B-301C
  • Tact time: 6s / 1chip
  • Temp: RT~400℃
  • 2heads

ACF異方性導電膜

ACF - Anisotropic Conductive Film ACF - Anisotropic Conductive Film
ACF圧着
ACF-30
  • Tact time: 4s
  • ACF length: 2~50mm
  • ACF width: 1~6mm

AAM-100
  • ACF feeding: Stepping motor
  • ACF cutting: Up/Down cylinder and cutter
  • ACF tension: Weight balance adjust
  • Tact time: 4.5s / 1panel(w/ main bonding 2s)
  • ACF spec: 2 or 3 layer
  • ACF attach length: ~60mm
  • ACF width: 1.2~5.0mm
  • ACF reel: ~φ150