COG & ACF
COG 実装技術 & 異方性導電膜(ACF)
Chip on Glass & Anisotropic Conductive Film
COGチップオングラス実装技術
COG 実装
- [Pre-bonder]A-30E CM
- Tact time: 5.2s / 1chip
- Chip size: 3x0.6~3x5mm
- Chip thickness:0.3~1.0mm
- [Main-bonder]B-301C
- Tact time: 6s / 1chip
- Temp: RT~400℃
- 2heads
ACF異方性導電膜
ACF圧着
ACF-30
- Tact time: 4s
- ACF length: 2~50mm
- ACF width: 1~6mm
AAM-100
- ACF feeding: Stepping motor
- ACF cutting: Up/Down cylinder and cutter
- ACF tension: Weight balance adjust
- Tact time: 4.5s / 1panel(w/ main bonding 2s)
- ACF spec: 2 or 3 layer
- ACF attach length: ~60mm
- ACF width: 1.2~5.0mm
- ACF reel: ~φ150