Capabilities

COG & ACF

Chip on Glass & Anisotropic Conductive Film

COGChip on Glass

COG - Chip on Glass COG - Chip on Glass COG - Chip on Glass
COG - Chip on Glass
COG Bonding
  • Auto supply by X, Y stage and pick up unit
  • Vacuum chip pick up Auto chip pre-aligner by cylinder
  • Tact time: 20s/1 chip (w main bonding 5s)
  • Min. chip size: 4.0(L)x1.0(W)x0.4(T)mm
  • Max. chip size: 25.0(L)x6.0(W)x1.5(T)mm
  • Min. pattern pitch (ITO): 35µm(STN), 28µm(TFT)

ACFAnisotropic Conductive Film

ACF - Anisotropic Conductive Film ACF - Anisotropic Conductive Film ACF - Anisotropic Conductive Film
ACF Attach
  • ACF feeding: Stepping motor
  • ACF cutting: Up/Down cylinder and cutter
  • ACF tension: Weight balance adjust
  • Tact time: 4.5s/1 panel (w/main bonding 2s)
  • ACF spec: 2 or 3 layer
  • ACF attach length: ~60mm
  • ACF width: 1.2~5.0mm
  • ACF reel: ~Ψ150